The Thermal & Fluid Sciences Affiliates and Sponsors Conference will be held at Stanford University on February 13-15, 2013.
The Thermal & Fluid Sciences Affiliates Program (TFSA) is the industrial liaison program of the Thermosciences Group and Flow Physics and Computation Group of the Mechanical Engineering Department at Stanford University. The program was started over 30 years ago to establish and maintain close ties between the Stanford faculty and engineers in industry. The program serves as a two-way conduit of recent research findings and industrial problems which motivate new research.
The program is administered at the faculty level and emphasizes person-to-person communications between the Stanford faculty and the industrial representatives.